IC chip, generally refers to all electronic components, is a circuit module that integrates a variety of electronic components on a silicon board to achieve a specific function. It is the most important part of electronic equipment, which is responsible for computing and storage functions. The application range of integrated circuits covers almost all electronic equipment for military and civilian use.

Chipset (Chipset) is the core component of the motherboard. According to the different arrangement position on the motherboard, it is usually divided into north bridge chip and south bridge chip.

With the rapid development of microelectronics technology, the size of the chip is getting smaller and smaller, and at the same time the calculation speed is getting faster and faster, and the heat generation is getting larger and larger. This puts higher requirements on the heat dissipation of the chip. Designers must use advanced heat dissipation technology and excellent heat dissipation materials to effectively take away the heat and ensure that the chip works normally within the maximum temperature that it can withstand.

At present, a commonly used heat dissipation method is to use a heat sink, which is mounted on the chip with thermal conductive materials and tools, so as to quickly remove the heat generated by the chip.

Because there will be many trenches or gaps between the bottom surface of the heat sink and the surface of the chip, all of which are air. Since air is a poor conductor of heat, the air gap will seriously affect the heat dissipation efficiency, making the performance of the radiator greatly compromised, or even unable to function. In order to reduce the gap between the chip and the heat sink and increase the contact area, it must be filled with thermally conductive materials with good thermal conductivity, such as thermally conductive tape, thermally conductive gaskets, thermally conductive silicone, thermally conductive adhesives, phase change materials, etc. As shown in Figure 2, the heat emitted by the chip is transferred to the radiator through the thermally conductive material, and then the high-speed rotation of the fan takes most of the heat away into the surrounding air through convection (forced convection and natural convection). The heat is removed, thus forming a heat dissipation path from the chip, then through the heat sink and the thermal conductive material, to the surrounding air.

With the increasing integration of IC chips, the requirements for the heat transfer effect of thermal interface materials have also increased. Our company has developed professional thermal interface materials for IC chip heat dissipation.